Interim Engineering Intern – Hardware (2027)
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- Stipend
- ₹40,000–70,000/month
- Location
- Bengaluru (and other India sites per posting)
- Work mode
- On-site
- Eligible batch
- Not mentioned
- Apply by
- No deadline listed – apply early
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About the role
Apply via the official link. Qualcomm is hiring a Interim Engineering Intern – Hardware (2027) in Bengaluru (and other India sites per posting) (internship; experience: Interim Engineering Intern_2027_HW; Bachelor's/Master's in EE/VLSI/Embedded/ECE; no years floor >2). Interim Engineering Intern – Hardware (2027) at Qualcomm India. Hardware/VLSI/embedded internship for campus grads with Bachelor’s/Master’s in Electrical Engineering, VLSI, Embedded or ECE. RTL/OO programming exposure and wireless/wired communications knowledge are valued. Note: Hardware/VLSI/embedded — tech but not software-SDE. Include for engineering intern coverage. Pay not published on the official posting; ₹40,000–70,000/month is a HireDoor market estimate.
Responsibilities
- Contribute to hardware/VLSI/embedded engineering projects as an interim intern.
- Apply RTL and/or strong OO programming knowledge where relevant.
- Learn Qualcomm engineering practices on India campus-grad teams.
Requirements
- Bachelor’s or Master’s in Electrical Engineering, VLSI, Embedded or ECE.
- Campus-grad / Interim Engineering Intern_2027_HW eligibility.
- Interest in silicon, RTL or embedded hardware systems.
Benefits
- Stipend est. ₹40,000–70,000/month (market estimate)
- Onsite · Bengaluru (and other India sites per posting)
- Official Qualcomm role
Required Skills
One-time payment · No auto-renewal
- 12-hour early access
- Premium WhatsApp group
- 1:1 interview counseling
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About Qualcomm
Qualcomm Incorporated is an American multinational technology corporation headquartered in San Diego, California. The company develops and designs technologies for global communications and computing, including next-generation mobile networks, smart devices, and semiconductors — such as mobile processors and artificial intelligence chips. The company holds essential patents for global mobile communication standards including 5G, 4G, CDMA2000, TD-SCDMA and WCDMA.
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Frequently Asked Questions
What is the salary for Interim Engineering Intern – Hardware (2027)?
The listed salary for Interim Engineering Intern – Hardware (2027) at Qualcomm is ₹40,000–70,000/month.
Where is this Interim Engineering Intern – Hardware (2027) role located?
This position is based in Bengaluru (and other India sites per posting) (Onsite).
What experience is required for Interim Engineering Intern – Hardware (2027)?
Candidates are expected to have Interim Engineering Intern_2027_HW; Bachelor's/Master's in EE/VLSI/Embedded/ECE; no years floor >2 of experience for this role.
How do I apply for Interim Engineering Intern – Hardware (2027) at Qualcomm?
Use the Apply button on this HireDoor job page to submit your application for Interim Engineering Intern – Hardware (2027) at Qualcomm.
What are the key benefits for Interim Engineering Intern – Hardware (2027)?
Key benefits include: Stipend est. ₹40,000–70,000/month (market estimate); Onsite · Bengaluru (and other India sites per posting); Official Qualcomm role.
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